SCLS407N April   1998  – December 2023 SN74LV373A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 5.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 5.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 5.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 5.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 5.12 Noise Characteristics
    13. 5.13 Operating Characteristics
    14. 5.14 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 22
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3.     Power Supply Recommendations
    4. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Community Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • DGS|20
  • DW|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LV373AUNIT
DB (SSOP)DGV (TVSOP)DW (SOIC)NS (SO)PW (TSSOP)RGY (VQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance94.5116.279.276.7128.234.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.431.243.743.270.542.9°C/W
RθJBJunction-to-board thermal resistance49.757.747.044.279.312.4°C/W
ψJTJunction-to-top characterization parameter18.50.918.616.823.40.8°C/W
ψJBJunction-to-board characterization parameter49.357.046.543.878.912.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—————7.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.