SCLS408L May   1998  – March 2023 SN74LV374A

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Timing Requirements
    10. 6.10 Noise Characteristics
    11. 6.11 Operating Characteristics, TA = 25°C
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LV374A UNIT
DB (SSOP) DW (SOIC) NS (SO) PW (TSSOP)
20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 94.5 102.3 76.7 102.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.4 69.9 43.2 36.5 °C/W
RθJB Junction-to-board thermal resistance 49.7 70.8 44.2 53.6 °C/W
ψJT Junction-to-top characterization parameter 18.5 46.4 16.8 2.4 °C/W
ψJB Junction-to-board characterization parameter 49.3 70.4 43.8 52.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.