SCES226K April   1999  – September 2024 SN74LV4040A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics
    6. 4.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 4.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 4.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 4.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 4.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 4.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 4.12 Noise Characteristics
    13. 4.13 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • NS|16
  • N|16
  • RGY|16
  • D|16
  • DGV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP) NS (SOP) PW (TSSOP) RGY (VQFN) UNIT
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 99.5 82 120 67 64 122.3 39 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.