SCLS520H August   2003  – October 2024 SN74LV4051A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information: SN74LV4051A-Q1
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics VCC = 2.5 V ± 0.2 V
    7. 5.7 Timing Characteristics VCC = 3.3 V ± 0.3 V
    8. 5.8 Timing Characteristics VCC = 5 V ± 0.5 V
    9. 5.9 AC Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DYY|16
  • DW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

TI recommends keeping the signal lines as short and as straight as possible. Incorporation of microstrip or stripline techniques is also recommended when signal lines are more than 1 inch long. These traces must be designed with a characteristic impedance of either 50Ω or 75Ω, as required by the application. Do not place this device too close to high-voltage switching components, as they may cause interference.