SCLS520H August   2003  – October 2024 SN74LV4051A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information: SN74LV4051A-Q1
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics VCC = 2.5 V ± 0.2 V
    7. 5.7 Timing Characteristics VCC = 3.3 V ± 0.3 V
    8. 5.8 Timing Characteristics VCC = 5 V ± 0.5 V
    9. 5.9 AC Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DYY|16
  • DW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information: SN74LV4051A-Q1

THERMAL METRIC (1) SN74LV4051A-Q1 SN74LV4051A-Q1 UNIT
PW (TSSOP) DYY (SOT)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  140.2 199.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.6 121.2 °C/W
RθJB Junction-to-board thermal resistance 98.7 129.0 °C/W
ΨJT Junction-to-top characterization parameter 13.4 24.6 °C/W
ΨJB Junction-to-board characterization parameter 97.3 126.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.