SCLS469J March 2003 – October 2024 SN74LV4052A-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC | SN74LV4052A-Q1 | SN74LV4052A-Q1 | UNIT | |
---|---|---|---|---|
PW (TSSOP) | DYY (SOT) | |||
16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 140.2 | 199.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 72.6 | 121.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 98.7 | 129.0 | °C/W |
ΨJT | Junction-to-top characterization parameter | 13.4 | 24.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 97.3 | 126.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |