SCLS917 may   2023 SN74LV4T08

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics 1.8-V VCC
    7. 6.7  Switching Characteristics 2.5-V VCC
    8. 6.8  Switching Characteristics 3.3-V VCC
    9. 6.9  Switching Characteristics 5.0-V VCC
    10. 6.10 Noise Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Clamp Diode Structure
      3. 8.3.3 LVxT Enhanced Input Voltage
        1. 8.3.3.1 Down Translation
        2. 8.3.3.2 Up Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20201111-CA0I-GHK7-S2JQ-JM1WBD1ZKZML-low.svgFigure 5-1 BQA Package, 14-Pin WQFN (Top View)
GUID-F1CB73BA-2101-4303-83C0-E5C299882608-low.gifFigure 5-2 PW Package, 14-Pin TSSOP (Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
1A1IChannel 1, Input A
1B2IChannel 1, Input B
1Y3OChannel 1, Output Y
2A4IChannel 2, Input A
2B5IChannel 2, Input B
2Y6OChannel 2, Output Y
GND7—Ground
3Y8OChannel 3, Output Y
3A9IChannel 3, Input A
3B10IChannel 3, Input B
4Y11OChannel 4, Output Y
4A12IChannel 4, Input A
4B13IChannel 4, Input B
VCC14—Positive Supply
Thermal Pad(2)—The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) BQA package only