4 Revision History
Changes from Revision I (December 2014) to Revision J (March 2023)
- Updated structural layout of document to current standard, updated
Features section, and added NS package to Package Information
tableGo
- Added ± to values in ESD Ratings sectionGo
- Updated thermal values for PW package from RθJA = 102.8 to 128.2,
RθJC(top) = 36.8 to 70.5, RθJB = 53.8 to 79.3, ΨJT =2.5 to 23.4, ΨJB = 53.3 to
78.9, all values in °C/WGo
Changes from Revision H (April 2005) to Revision I (December 2014)
- Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
- Deleted Ordering Information table.Go
- Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. Go