SCLS410N april   1998  – august 2023 SN74LV541A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Noise Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Partial Power Down (Ioff)
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Glossary
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20211117-SS0I-4VQF-GV22-HQ4B18DGFGR5-low.gifFigure 5-1 DB, DGV, DW, NS, PW or DGS Package, 20-Pin SSOP, TVSOP, SOIC, SO, TSSOP or VSSOP (Top View)
GUID-20210920-SS0I-W1XM-ZJ3J-G2H0WVT03ZGJ-low.gifFigure 5-2 RGY and RKS Package, 20-Pin VQFN with (Exposed Thermal Pad Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
OE11IOutput enable input 1, active low
A12IInput for channel 1
A23IInput for channel 2
A34IInput for channel 3
A45IInput for channel 4
A56IInput for channel 5
A67IInput for channel 6
A78IInput for channel 7
A89IInput for channel 8
GND10GGround
Y811OOutput for channel 8
Y712OOutput for channel 7
Y613OOutput for channel 6
Y514OOutput for channel 5
Y415OOutput for channel 4
Y316OOutput for channel 3
Y217OOutput for channel 2
Y118OOutput for channel 1
OE219IOutput enable input 2, active low
VCC20PPostive supply
Thermal Pad(2)—The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) RKS package only