SCLS410N april   1998  – august 2023 SN74LV541A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Noise Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Partial Power Down (Ioff)
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Glossary
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision M (March 2023) to Revision N (August 2023)

  • Deleted DGV from Package Information table and ESD rating from Features sectionGo
  • Updated thermal values for PW package from RθJA = 102.8 to 128.2, RθJC(top) = 36.8 to 70.5, RθJB = 53.8 to 79.3, ΨJT = 2.5 to 23.4, ΨJB = 53.3 to 78.9, all values in °C/WGo

Changes from Revision L (January 2023) to Revision M (March 2023)

  • Updated thermal values for DB package from RθJA = 96.0 to 118.2, RθJC(top) = 56.7 to 77.2, RθJB = 51.2 to 73, ΨJT = 19.4 to 42.2, ΨJB = 50.8 to 72.6, all values in °C/W Go
  • Updated thermal values for NS package from RθJA = 77.1 to 108.1, RθJC(top) = 43.6 to 73.9, RθJB = 44.6 to 73.1, ΨJT = 17.2 to 44.1, ΨJB = 44.2 to 72.8, all values in °C/WGo