SCLS887 December   2022 SN74LV594A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics: VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics: VCC = 5 V ± 0.5 V
    9. 6.9  Timing Requirements: VCC = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements: VCC = 3.3 V ± 0.3 V
    11. 6.11 Timing Requirements: VCC = 5 V ± 0.5 V
    12. 6.12 Noise Characteristics
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LV594A-Q1 UNIT

BQB (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 86.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance

82.6
RθJB Junction-to-board thermal resistance 54.9
ψJT Junction-to-top characterization parameter 9.5
ψJB Junction-to-board characterization parameter 54.9
ψJC Junction-to-bottom characterization parameter

32.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.