SCLS933 june   2023 SN74LV6T17-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
  8. 7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Balanced CMOS Push-Pull Outputs
      2. 9.3.2 Clamp Diode Structure
      3. 9.3.3 CMOS Schmitt-Trigger Inputs
      4. 9.3.4 LVxT Enhanced Input Voltage
        1. 9.3.4.1 Down Translation
        2. 9.3.4.2 Up Translation
      5. 9.3.5 Wettable Flanks
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Power Considerations
        2. 10.2.1.2 Input Considerations
        3. 10.2.1.3 Output Considerations
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 SN74LV6T17-Q1 BQA Package, 14-Pin WQFN (Top View)
Figure 5-2 SN74LV6T17-Q1 PW Package, 14-Pin TSSOP (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME BQA PW
1A I Channel 1, Input A
1Y O Channel 1, Ouput Y
2A I Channel 2, Input A
2Y O Channel 2, Ouput Y
3ACC I Channel 3, Input A
3Y O Channel 3, Ouput Y
GND G Ground
4Y O Channel 4, Output Y
4A I Channel 4, Input A
5Y O Channel 5, Output Y
5A I Channel 5, Input A
6Y O Channel 6, Output Y
6A I Channel 6, Input A
VCC P Positive Supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) BQA package only.