SCLS392G April   1998  – February 2015 SN74LV86A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, VCC = 2.5 V ±0.2 V
    7. 7.7  Switching Characteristics, VCC = 3.3 V ±0.3 V
    8. 7.8  Switching Characteristics, VCC = 5 V ±0.5 V
    9. 7.9  Noise Characteristics for SN74LV86A
    10. 7.10 Operating Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
VI Input voltage(2) –0.5 7 V
VO Voltage applied to any output in the high-impedance or power-off state(2) –0.5 7 V
VO Output voltage(2)(3) –0.5 VCC + 0.5 V V
IIK Input clamp current, VI < 0 –20 mA
IOK Output clamp current, VO < 0 –50 mA
IO Continuous output current, VO = 0 to VCC –25 25 mA
Continuous current through VCC or GND –50 50 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) This value is limited to 5.5-V maximum.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

see (1)
MIN MAX UNIT
VCC Supply voltage 2 5.5 V
VIH High-level input voltage VCC = 2 V 1.5 V
VCC = 2.3 V to 2.7 V VCC × 0.7
VCC = 3 V to 3.6 V VCC × 0.7
VCC = 4.5 V to 5.5 V VCC × 0.7
VIL Low-level input voltage VCC = 2 V 0.5 V
VCC = 2.3 V to 2.7 V VCC × 0.3
VCC = 3 V to 3.6 V VCC × 0.3
VCC = 4.5 V to 5.5 V VCC × 0.3
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 2 V –50 µA
VCC = 2.3 V to 2.7 V –2 mA
VCC = 3 V to 3.6 V –6
VCC = 4.5 V to 5.5 V –12
IOL Low-level output current VCC = 2 V 50 µA
VCC = 2.3 V to 2.7 V 2 mA
VCC = 3 V to 3.6 V 6
VCC = 4.5 V to 5.5 V 12
Δt/Δv Input transition rise or fall rate VCC = 2.3 V to 2.7 V 200 ns/V
VCC = 3 V to 3.6 V 100
VCC = 4.5 V to 5.5 V 20
TA Operating free-air temperature –55 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

7.4 Thermal Information

THERMAL METRIC(1) D DB DGV NS PW UNIT
14 PINS
RθJA Junction-to-ambient thermal resistance(2) 90.6 107.1 129.0 90.7 122.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.9 59.6 52.1 48.3 51.4
RθJB Junction-to-board thermal resistance 44.8 54.4 62.0 49.4 64.4
ψJT Junction-to-top characterization parameter 14.7 20.5 6.5 14.6 6.7
ψJB Junction-to-board characterization parameter 44.5 53.8 61.3 49.1 63.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC SN54LV86A SN74LV86A
–40°C to 125°C		 UNIT
MIN TYP MAX MIN TYP MAX
VOH IOH = –50 µA 2 to 5.5 V VCC – 0.1 VCC – 0.1 V
IOH = –2 mA 2.3 V 2 2
IOH = –6 mA 3 V 2.48 2.48
IOH = –12 mA 4.5 V 3.8 3.8
VOL IOL = 50 µA 2 to 5.5 V 0.1 0.1 V
IOL = 2 mA 2.3 V 0.4 0.4
IOL = 6 mA 3 V 0.44 0.44
IOL = 12 mA 4.5 V 0.55 0.55
II VI = 5.5 V or GND 0 to 5.5 V ±1 ±1 µA
ICC VI = VCC or GND, IO = 0 5.5 V 20 20 µA
Ioff VI or VO = 0 to 5.5 V 0 5 5 µA
Ci VI = VCC or GND 3.3 V 1.4 1.4 pF

7.6 Switching Characteristics, VCC = 2.5 V ±0.2 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE TA = 25°C MIN MAX UNIT
MIN TYP MAX
tpd A or B Y CL = 15 pF 7.9(1) 17.6(1) 1(2) 21(2) ns
CL = 50 pF 10.5 22.6 1 26.5
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) This note applies to SN54LV86A only: On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.7 Switching Characteristics, VCC = 3.3 V ±0.3 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE TA = 25°C MIN MAX UNIT
MIN TYP MAX
tpd A or B Y CL = 15 pF 5.5(1) 11(1) 1(2) 13(2) ns
CL = 50 pF 7.4 14.5 1 16.5
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) This note applies to SN54LV86A only: On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.8 Switching Characteristics, VCC = 5 V ±0.5 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE TA = 25°C MIN MAX UNIT
MIN TYP MAX
tpd A or B Y CL = 15 pF 3.7(1) 6.8(1) 1(2) 8(2) ns
CL = 50 pF 5.3 8.8 1 10
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) This note applies to SN54LV86A only: On products compliant to MIL-PRF-38535, this parameter is not production tested.

7.9 Noise Characteristics for SN74LV86A

VCC = 3.3 V, CL = 50 pF, TA = 25°C (see (1))
PARAMETER MIN TYP MAX UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.2 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.1 –0.8
VOH(V) Quiet output, minimum dynamic VOH 3.1
VIH(D) High-level dynamic input voltage 2.31
VIL(D) Low-level dynamic input voltage 0.99
(1) Characteristics are for surface-mount packages only.

7.10 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance CL = 50 pF, ƒ = 10 MHz 3.3 V 8.4 pF
5 V 8.8

7.11 Typical Characteristics

SN54LV86A SN74LV86A D001_SCLS392.gif
Figure 1. tpd vs Temperature at 3.3 V
SN54LV86A SN74LV86A D002_SCLS392.gif
Figure 2. tpd vs VCC at 25°C