SCAS986 March   2024 SN74LV8T164

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Noise Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Latching Logic with Known Power-Up State
      3. 7.3.3 LVxT Enhanced Input Voltage
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20201022-CA0I-BGFT-PNPD-24KL64GRTLDJ-low.gifFigure 4-1 PW Package, 14-Pin TSSOP (Top View)
GUID-20240216-SS0I-Z0WM-23G0-R6FQ3GP09L8C-low.svgFigure 4-2 BQA Package, 14-Pin WQFN (Transparent Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
A1I

Serial input A

B2

I

Serial input B

QA3O

Parallel output A

QB4O

Parallel output B

QC5O

Parallel output C

QD6O

Parallel output D

GND7GGround
CLK8

I

Clock, rising edge triggered

CLR9

I

Clear, active-low

QE

10

O

Parallel output E

QF

11

O

Parallel output F

QG12

O

Parallel output G

QH

13

O

Parallel output H

VCC14

P

Power supply

Thermal Pad(2)

—

The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power
(2) BQA package only