SCLS907A December   2022  – April 2023 SN74LV8T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics - 1.8-V VCC
    7. 6.7  Switching Characteristics - 2.5-V VCC
    8. 6.8  Switching Characteristics - 3.3-V VCC
    9. 6.9  Switching Characteristics - 5-V VCC
    10. 6.10 Noise Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Clamp Diode Structure
      3. 8.3.3 LVxT Enhanced Input Voltage
        1. 8.3.3.1 Down Translation
        2. 8.3.3.2 Up Translation
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
      1. 9.3.1 Power Considerations
      2. 9.3.2 Input Considerations
      3. 9.3.3 Output Considerations
      4. 9.3.4 Detailed Design Procedure
    4. 9.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.4 Wettable Flanks

This device includes wettable flanks for at least one package. See the Features section on the front page of the data sheet for which packages include this feature.

GUID-20210830-SS0I-QHWX-L5WT-QDZVQTLHTMWL-low.svg Figure 8-4 Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering

Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with automatic optical inspection (AOI). As shown in Figure 8-4, a wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet. See the mechanical drawing for additional details.