SCLS902 February   2024 SN74LV8T594

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7.     13
    8. 5.7 Switching Characteristics
    9. 5.8 Noise Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Feature Description
    1. 8.1 Balanced CMOS Push-Pull Outputs
    2. 8.2 Latching Logic with Known Power-Up State
    3. 8.3 LVxT Enhanced Input Voltage
    4. 8.4 Clamp Diode Structure
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) BQB (WQFN) PW (TSSOP) UNIT
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 91.8 135.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 87.7 70.3 °C/W
RθJB Junction-to-board thermal resistance 61.6 81.3 °C/W
ΨJT Junction-to-top characterization parameter 11.9 22.5 °C/W
YJB Junction-to-board characterization parameter 61.4 80.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 39.4 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.