SCAS995 March   2024 SN74LV8T595-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Noise Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Balanced CMOS 3-State Outputs
      3. 7.3.3 Latching Logic with Known Power-Up State
      4. 7.3.4 LVxT Enhanced Input Voltage
      5. 7.3.5 Wettable Flanks
      6. 7.3.6 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Timing Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER DESCRIPTION CONDITION VCC TA = 25°C -40°C to 125°C UNIT
MIN MAX MIN MAX
tH Hold time SER after SRCLK↑ 1.8V 0 0 ns
tSU Setup time SER before SRCLK↑ 1.8V 7.9 9.8 ns
tSU Setup time SRCLK↑ before RCLK↑ 1.8V 8.1 10.1 ns
tSU Setup time SRCLR high (inactive) before SRCLK↑ 1.8V 2.2 3 ns
tSU Setup time SRCLR low before RCLK↑ 1.8V 8.9 11.2 ns
tW Pulse duration RCLK or SRCLK high or low 1.8V 5.9 7 ns
tW Pulse duration SRCLR low 1.8V 6.5 8.3 ns
tH Hold time SER after SRCLK↑ 2.5V 0 0 ns
tSU Setup time SER before SRCLK↑ 2.5V 4.6 5.9 ns
tSU Setup time SRCLK↑ before RCLK↑ 2.5V 3.9 5.3 ns
tSU Setup time SRCLR high (inactive) before SRCLK↑ 2.5V 1.1 1.7 ns
tSU Setup time SRCLR low before RCLK↑ 2.5V 5.1 6.6 ns
tW Pulse duration RCLK or SRCLK high or low 2.5V 4.3 4.3 ns
tW Pulse duration SRCLR low 2.5V 4.3 5.2 ns
tH Hold time SER after SRCLK↑ 3.3V 0 0 ns
tSU Setup time SER before SRCLK↑ 3.3V 3.2 4 ns
tSU Setup time SRCLK↑ before RCLK↑ 3.3V 2.5 3.2 ns
tSU Setup time SRCLR high (inactive) before SRCLK↑ 3.3V 0.7 1 ns
tSU Setup time SRCLR low before RCLK↑ 3.3V 3.6 4.5 ns
tW Pulse duration RCLK or SRCLK high or low 3.3V 4.3 4.3 ns
tW Pulse duration SRCLR low 3.3V 4.3 4.3 ns
tH Hold time SER after SRCLK↑ 5V 0 0 ns
tSU Setup time SER before SRCLK↑ 5V 1.3 1.8 ns
tSU Setup time SRCLK↑ before RCLK↑ 5V 1.6 2.1 ns
tSU Setup time SRCLR high (inactive) before SRCLK↑ 5V 0.5 0.7 ns
tSU Setup time SRCLR low before RCLK↑ 5V 1.6 2.1 ns
tW Pulse duration RCLK or SRCLK high or low 5V 4.3 4.3 ns
tW Pulse duration SRCLR low 5V 4.3 4.3 ns