SCAS994 March   2024 SN74LV8T595

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Noise Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Balanced CMOS 3-State Outputs
      3. 7.3.3 Latching Logic with Known Power-Up State
      4. 7.3.4 LVxT Enhanced Input Voltage
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-77437250-2CCB-4CED-9FFE-AFDA41812B6A-low.gifFigure 4-1 PW Package, 16-Pin TSSOP (Top View)
GUID-20200810-CA0I-Q9NM-WJZN-2VVL5S1MZF0C-low.gifFigure 4-2 BQB Package, 16-Pin WQFN (Transparent Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
QB1OQB output
QC2OQC output
QD3OQD output
QE4OQE output
QF5OQF output
QG6OQG output
QH7OQH output
GND8GGround
QH'9OSerial output, can be used for cascading
SRCLR10IShift register clear, active low
SRCLK11IShift register clock, rising edge triggered
RCLK12IOutput register clock, rising edge triggered
OE13IOutput Enable, active low
SER14ISerial input
QA15OQA output
VCC16PPositive supply
Thermal Pad(2)

—

The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power
(2) BQB package only