SCAS280S January   1993  – May 2024 SN54LVC02A , SN74LVC02A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC02A
    4. 4.4  Recommended Operating Conditions, SN74LVC02A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC02A
    7. 4.7  Electrical Characteristics, SN74LVC02A
    8. 4.8  Switching Characteristics, SN54LVC02A
    9. 4.9  Switching Characteristics, SN74LVC02A
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • PW|14
  • BQA|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision R (March 2024) to Revision S (May 2024)

  • Updated RθJA values: DB = 96 to 140.4, NS = 76 to 123.8, PW = 113 to 150.8, RGY = 47 to 92.1; Updated DB, NS, PW, and RGY packages for RθJC(top), RθJB, ΨJT, ΨJB, and RθJC(bot), all values in °C/WGo

Changes from Revision Q (July 2005) to Revision R (March 2024)

  • Added Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes,Application and Implementation section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added BQA package to Package Information table, Pin Configuration and Functions section, and Thermal Information table Go