SCAS763D February   2004  – October 2024 SN74LVC126A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

SN74LVC126A-Q1 SN74LVC126A-Q1 D or PW Package;14-Pin SOIC or TSSOP (Top View)Figure 3-1 SN74LVC126A-Q1 D or PW Package;14-Pin SOIC or TSSOP (Top View)
SN74LVC126A-Q1 SN74LVC126A-Q1 BQA Package;14-Pin WQFN (Top View)Figure 3-2 SN74LVC126A-Q1 BQA Package;14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN I/O(1) DESCRIPTION
NO. NAME
1 1OE I Output enable 1
2 1A I Gate 1 input
3 1Y O Gate 1 output
4 2OE I Output enable 2
5 2A I Gate 2 input
6 2Y O Gate 2 output
7 GND — Ground pin
8 3Y O Gate 3 output
9 3A I Gate 3 input
10 3OE I Output enable 3
11 4Y O Gate 4 output
12 4A I Gate 4 input
13 4OE I Output Enable 4
14 VCC — Power pin
Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable