SCAS285AC March   1993  – April 2022 SN54LVC14A , SN74LVC14A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: SN54LVC14A
    4. 6.4  Recommended Operating Conditions: SN74LVC14A
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics, SN54LVC14A
    7. 6.7  Electrical Characteristics, SN74LVC14A
    8. 6.8  Switching Characteristics, SN54LVC14A
    9. 6.9  Switching Characteristics, SN74LVC14A
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Over-Voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)SN74LVC14AUNIT
D (SOIC)DB (SSOP)DGV (TVSOP)NS (SO)PW (TSSOP)RGY (LCCC)
14 PINS20 PINS
RθJAJunction-to-ambient thermal resistance117.6131.8153.5115.7145.993.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance78.283.975.272.273.4106.7°C/W
RθJBJunction-to-board thermal resistance71.979.286.674.487.769.8°C/W
ψJTJunction-to-top characterization parameter39.341.719.933.718.922.0°C/W
ψJBJunction-to-board characterization parameter71.678.685.974.187.170.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—————49.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.