SCES213X April   1999  – April 2014 SN74LVC1G02

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF
    7. 6.7  Switching Characteristics, -40°C to 85°C
    8. 6.8  Switching Characteristics, -40°C to 125°C
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range –0.5 6.5 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Voltage range applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 Handling Ratings

PARAMETER DEFINITION MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 1
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions(1)

MIN MAX UNIT
VCC Supply voltage Operating 1.65 5.5 V
Data retention only 1.5
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 3 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 × VCC
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 3 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 × VCC
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 3 V –16
–24
VCC = 4.5 V –32
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 3 V 16
24
VCC = 4.5 V 32
Δt/Δv Input transition rise or fall rate VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 ns/V
VCC = 3.3 V ± 0.3 V 10
VCC = 5 V ± 0.5 V 5
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC1G02 UNIT
DBV DCK DRL DRY YZP DPW
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 229 278 243 439 130 340 °C/W
RθJCtop Junction-to-case (top) thermal resistance 164 93 78 277 54 215
RθJB Junction-to-board thermal resistance 62 65 78 271 51 294
ψJT Junction-to-top characterization parameter 44 2 10 84 1 41
ψJB Junction-to-board characterization parameter 62 64 77 271 50 294
RθJCbot Junction-to-case (bottom) thermal resistance – – – – – 250
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC –40°C to 85°C –40°C to 125°C UNIT
MIN TYP(1) MAX MIN TYP(1) MAX
VOH IOH = –100 μA 1.65 V to 5.5 V VCC  – 0.1 VCC  – 0.1 V
IOH = –4 mA 1.65 V 1.2 1.2
IOH = –8 mA 2.3 V 1.9 1.9
IOH = –16 mA 3 V 2.4 2.4
IOH = –24 mA 2.3 2.3
IOH = –32 mA 4.5 V 3.8 3.8
VOL IOL = 100 μA 1.65 V to 5.5 V 0.1 0.1 V
IOL = 4 mA 1.65 V 0.45 0.45
IOL = 8 mA 2.3 V 0.3 0.3
IOL = 16 mA 3 V 0.4 0.4
IOL = 24 mA 0.55 0.55
IOL = 32 mA 4.5 V 0.55 0.55
II A or B
inputs		 VI = 5.5 V or GND 0 to 5.5 V ±5 ±5 μA
Ioff VI or VO = 5.5 V 0 ±10 ±10 μA
ICC VI = 5.5 V or GND IO = 0 1.65 V to 5.5 V 10 10 μA
ΔICC One input at VCC  – 0.6 V,
Other inputs at VCC or GND		 3 V to 5.5 V 500 500 μA
Ci VI = VCC or GND 3.3 V 4 4 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.

6.6 Switching Characteristics, CL = 15 pF

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 –40°C to 85°C UNIT
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 3.3 V
± 0.3 V		 VCC = 5 V
± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
tpd A or B Y 1.9 7.2 0.8 4.4 0.8 3.6 0.8 3.4 ns

6.7 Switching Characteristics, –40°C to 85°C

over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 –40°C to 85°C UNIT
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 3.3 V
± 0.3 V		 VCC = 5 V
± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
tpd A or B Y 2.8 8 1.2 5.5 1 4.5 1 4 ns

6.8 Switching Characteristics, –40°C to 125°C

PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 –40°C to 125°C UNIT
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 3.3 V
± 0.3 V		 VCC = 5 V
± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
tpd A or B Y 2.8 9 1.2 6 1.0 5 1 4.5 ns

6.9 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz 23 23 23 25 pF

6.10 Typical Characteristics

D001_SCES213.gifFigure 1. TPD Across Temperature AT 3.3 V VCC
D002_SCES213.gifFigure 2. TPD Across VCC at 25°C