Refer to the PDF data sheet for device specific package drawings
This single inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The output of the SN74LVC1G06 device is open-drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
SN74LVC1G06DBV | SOT-23 (5) | 2.90 mm × 1.60 mm |
SN74LVC1G06DCK | SC70 (5) | 2.00 mm × 1.25 mm |
SN74LVC1G06DRL | SOT-5X3 (5) | 1.60 mm × 1.20 mm |
SN74LVC1G06DRY | SON (6) | 1.45 mm × 1.00 mm |
SN74LVC1G06DSF | SON (6) | 1.00 mm x 1.00 mm |
SN74LVC1G06YZP | DSBGA (5) | 1.40 mm × 0.90 mm |
SN74LVC1G06YZV | DSBGA (4) | 0.90 mm × 0.90 mm |
SN74LVC1G06DPW | X2SON (5) | 0.80 mm x 0.80 mm |
Changes from Y Revision (February 2017) to Z Revision
Changes from X Revision (August 2015) to Y Revision
Changes from W Revision (December 2013) to X Revision
Changes from V Revision (November 2012) to W Revision
PIN | I/O | DESCRIPTION | ||||
---|---|---|---|---|---|---|
NAME | DBV, DCK, DRL, DPW | DRY, DSF | YZP | YZV | ||
A | 2 | 2 | B1 | A1 | I | Input |
DNU | — | — | A1 | — | — | Do not use |
GND | 3 | 3 | C1 | B1 | — | Ground |
NC | 1 | 1 | — | — | — | Not connected |
5 | ||||||
VCC | 5 | 6 | A2 | A2 | — | Power pin |
Y | 4 | 4 | C2 | B2 | O | Output |