SCES586E July   2004  – March 2024 SN74LVC1G123

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Switching Characteristics, CL = 15 pF, –40°C to 85°C
    8. 5.8  Switching Characteristics, CL = 50 pF, –40°C to 85°C
    9. 5.9  Switching Characteristics, CL = 50 pF, –40°C to 125°C
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision D (June 2015) to Revision E (March 2024)

  • Updated format to match new TI layout and flow. Tables, figures and cross-references use a new numbering sequence throughout the documentGo

Changes from Revision C (October 2013) to Revision D (June 2015)

  • Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed duplicate Timing Requirements table Go

Changes from Revision B (January 2007) to Revision C (October 2013)

  • Updated document to new TI data sheet format.Go
  • Updated Features Go
  • Updated operating temperature range.Go
  • Added Thermal Information table.Go