SCES218Y APRIL   1999  – November 2018 SN74LVC1G14

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Logic Diagram (Positive Logic) (DBV, DCK, DRL, DRY, DPW, and YZP Package)
      2.      Logic Diagram (Positive Logic) (YZV Package)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: –40°C to 85°C
    7. 6.7 Switching Characteristics: –40°C to 125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-Voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YZV|4
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC1G14 UNIT
DBV
(SOT-23)		 DCK
(SC70)		 DRL
(SOT-5X3)		 DRY
(SON)		 DPW
(X2SON)		 YZV
(DSBGA)		 YZP
(DSBGA)
5 PINS 5 PINS 5 PINS 5 PINS 5 PINS 4 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 247.2 276.1 296.2 369.6 522.9 168.2 146.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 154.5 178.9 137.3 257.6 250.5 2.1 1.4 °C/W
RθJB Junction-to-board thermal resistance 86.8 70.9 145.3 230.8 384.0 55.9 39.8 °C/W
ψJT Junction-to-top characterization parameter 58.0 47.0 14.7 77.2 46.5 1.1 0.7 °C/W
ψJB Junction-to-board characterization parameter 86.4 69.3 145.9 231.0 382.8 56.3 39.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 174.1 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.