SCES648A February   2006  – August 2019 SN74LVC1G32-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF
    7. 6.7  Switching Characteristics, 1.8 V and 2.5V
    8. 6.8  Switching Characteristics, 3.3 V and 5 V
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC1G32-Q1 UNIT
DBV DCK DRY
5 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 229 278 439 °C/W
RθJCtop Junction-to-case (top) thermal resistance 164 93 277 °C/W
RθJB Junction-to-board thermal resistance 62 65 271 °C/W
ψJT Junction-to-top characterization parameter 44 2 84 °C/W
ψJB Junction-to-board characterization parameter 62 64 271 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance – – – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.