SCES581D JULY   2004  – October 2015 SN74LVC1GX04

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, SN74LVC1GX04
    7. 6.7  Switching Characteristics, SN74LVC1GX04
    8. 6.8  Switching Characteristics, SN74LVC1GX04
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DRL|6
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 6.5 V
VI Input voltage(2) –0.5 6.5 V
VO Voltage applied to Y output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Voltage applied to any output in the high or low state(2) (3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions(1)

MIN MAX UNIT
VCC Supply voltage Operating 1.65 5.5 V
Data retention only 1.5
Crystal oscillator use 2
VIH High-level input voltage VCC = 1.65 V to 5.5 V 0.75 × VCC V
VIL Low-level input voltage VCC = 1.65 V to 5.5 V 0.25 × VCC V
VI Input voltage 0 5.5 V
VO Output voltage X2, Y 0 VCC V
Y output only, Power-down mode, VCC = 0 V 0 5.5
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 3 V –16
–24
VCC = 4.5 V –32
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 3 V 16
24
VCC = 4.5 V 32
Δt/Δv Input transition rise or fall rate VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 ns/V
VCC = 3.3 V ± 0.3 V 10
VCC = 5 V ±0.5 V 10
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC1GX04 UNIT
DBV (SOT-23) DCK (SC70) DRL (SOT)
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165 259 142 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VOH IOH = –100 μA VI = 5.5 V or GND TA = –40°C to 125°C 1.65 V to 5.5 V VCC  – 0.1 V
IOH = –4 mA 1.65 V 1.2
IOH = –8 mA 2.3 V 1.9
IOH = –16 mA 3 V 2.4
IOH = –24 mA 2.3
IOH = –32 mA 4.5 V 3.8
VOL IOL = 100 μA VI = 5.5 V or GND TA = –40°C to 125°C 1.65 V to 5.5 V 0.1 V
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
IOL = 16 mA TA = –40°C to 125°C 3 V 0.4
IOL = 24 mA TA = –40°C to 85°C 3 V 0.55
TA = –40°C to 125°C 0.63
IOL = 32 mA TA = –40°C to 85°C 4.5 V 0.55
TA = –40°C to 125°C 0.7
II X1 VI = 5.5 V or GND TA = –40°C to 125°C 0 to 5.5 V ±5 μA
Ioff X1, Y VI or VO = 5.5 V TA = –40°C to 125°C 0 ±10 μA
ICC VI = 5.5 V or GND, IO = 0 TA = –40°C to 125°C 1.65 V to 5.5 V 10 μA
Ci VI = VCC or GND 3.3 V 7 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.

6.6 Switching Characteristics, SN74LVC1GX04

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEMPERATURE VCC MIN MAX UNIT
tpd X1 X2 –40°C to 85°C VCC = 1.8 V ± 0.15 V 1 4 ns
VCC = 2.5 V ± 0.2 V 0.8 2.6
VCC = 3.3 V ± 0.3 V 0.6 2.4
VCC = 5 V ± 0.5 V 0.5 2
Y(1) –40°C to 85°C VCC = 1.8 V ± 0.15 V 3.5 10
VCC = 2.5 V ± 0.2 V 2.2 6
VCC = 3.3 V ± 0.3 V 2 5
VCC = 5 V ± 0.5 V 1.5 3.5
(1) X2 – no external load

6.7 Switching Characteristics, SN74LVC1GX04

over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEMPERATURE VCC MIN MAX UNIT
tpd X1 X2 –40°C to 85°C VCC = 1.8 V ± 0.15 V 1.1 7 ns
VCC = 2.5 V ± 0.2 V 0.8 4
VCC = 3.3 V ± 0.3 V 0.8 3.7
VCC = 5 V ± 0.5 V 0.8 3
Y(1) –40°C to 85°C VCC = 1.8 V ± 0.15 V 3.8 18
VCC = 2.5 V ± 0.2 V 2 7.4
VCC = 3.3 V ± 0.3 V 2 7.8
VCC = 5 V ± 0.5 V 2 5
(1) X2 – no external load

6.8 Switching Characteristics, SN74LVC1GX04

over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEMPERATURE VCC MIN MAX UNIT
tpd X1 X2 –40°C to 125°C VCC = 1.8 V ± 0.15 V 1.1 8 ns
VCC = 2.5 V ± 0.2 V 0.8 5
VCC = 3.3 V ± 0.3 V 0.8 4.3
VCC = 5 V ± 0.5 V 0.8 3.5
Y(1) –40°C to 125°C VCC = 1.8 V ± 0.15 V 3.8 20
VCC = 2.5 V ± 0.2 V 2 8.4
VCC = 3.3 V ± 0.3 V 2 8.8
VCC = 5 V ± 0.5 V 2 5.5
(1) X2 – no external load

6.9 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz VCC = 1.8 V 22 pF
VCC = 2.5 V 22
VCC = 3.3 V 24
VCC = 5 V 35

6.10 Typical Characteristics

SN74LVC1GX04 typ_char_SCES581.gif Figure 1. Open-Loop Gain Characteristics of Oscillator Amplifier