SCES677F September   2006  – June 2024 SN74LVC1T45-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.8V ±0.15V
    7. 5.7  Switching Characteristics: VCCA = 2.5V ±0.2V
    8. 5.8  Switching Characteristics: VCCA = 3.3V ±0.3V
    9. 5.9  Switching Characteristics: VCCA = 5V ±0.5V
    10. 5.10 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Glitch-Free Power Supply Sequencing
    4. 6.4 Device Functional Modes
  9.   Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Enable Times
    2. 7.2 Typical Applications
      1. 7.2.1 Unidirectional Logic Level-Shifting Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Bidirectional Logic Level-Shifting Application
        1. 7.2.2.1 Detailed Design Procedure
        2. 7.2.2.2 Application Curves
    3.     35
    4. 7.3 Power Supply Recommendations
    5. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  11. 8Revision History
  12. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

For device reliability, the following common printed-circuit board layout guidelines are recommended:

  • Bypass capacitors must be used on power supplies.
  • Short trace lengths must be used to avoid excessive loading.
  • Placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of signals depends on the system requirements.