SCES515N December   2003  – June 2024 SN74LVC1T45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics (VCCA = 1.8V ± 0.15V)
    7. 5.7  Switching Characteristics (VCCA = 2.5V ± 0.2V)
    8. 5.8  Switching Characteristics (VCCA = 3.3V ± 0.3V)
    9. 5.9  Switching Characteristics (VCCA = 5V ±0.5V)
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65V to 5.5V Power-Supply Range
      2. 7.3.2 Support High Speed Translation
      3. 7.3.3 Ioff Supports Partial Power-Down Mode Operation
      4. 7.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 7.3.5 Glitch-Free Power Supply Sequencing
      6. 7.3.6 Vcc Isolation
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
        3. 8.2.2.3 Application Curve
    3.     42
    4. 8.3 Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1T45UNIT
DBV
(SOT-23)		DCK
(SC70)		DPK
(USON)		DRL
(SOT)		YZP
(DSBGA)
6 PINS
RθJAJunction-to-ambient thermal resistance215.1210.9278.3223.7131.0°C/W
RθJC(top)Junction-to-case (top) thermal resistance136.5139.2133.488.71.3°C/W
RθJBJunction-to-board thermal resistance96.672174.158.422.6°C/W
ψJTJunction-to-top characterization parameter71.554.923.45.95.2°C/W
ψJBJunction-to-board characterization parameter96.371.7173.558.122.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.