SCES515N December   2003  – June 2024 SN74LVC1T45

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics (VCCA = 1.8V ± 0.15V)
    7. 5.7  Switching Characteristics (VCCA = 2.5V ± 0.2V)
    8. 5.8  Switching Characteristics (VCCA = 3.3V ± 0.3V)
    9. 5.9  Switching Characteristics (VCCA = 5V ±0.5V)
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65V to 5.5V Power-Supply Range
      2. 7.3.2 Support High Speed Translation
      3. 7.3.3 Ioff Supports Partial Power-Down Mode Operation
      4. 7.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 7.3.5 Glitch-Free Power Supply Sequencing
      6. 7.3.6 Vcc Isolation
    4. 7.4 Device Functional Modes
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
        3. 8.2.2.3 Application Curve
    3.     42
    4. 8.3 Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Revision History

Changes from Revision M (November 2022) to Revision N (June 2024)

  • Updated the Power Supply Recommendations sectionGo

Changes from Revision L (February 2017) to Revision M (November 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the thermals in the Thermal Information sectionGo
  • Updated the Switching Characterisitcs sections: extended some minimum specifications for lower delays Go
  • Updated the Ioff Supports Partial Power-Down Mode Operation sectionGo
  • Added the Balanced High-Drive CMOS Push-Pull Outputs and VCC Isolation sectionsGo