SCES307J August   2001  – July 2015 SN74LVC2G06

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics for -40°C to 85°C
    7. 6.7 Switching Characteristics for -40°C to 125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DSF|6
  • YZP|6
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Available in the Texas Instruments
    Package
  • Supports 5-V VCC Operation
  • Max tpd of 3.4 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Inputs and Open-Drain Outputs Accept
    Voltages up to 5.5 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • Supports Down-Translation
    (5 V to 3.3 V and 3.3 V to 1.8 V)
  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

2 Applications

  • AV Receivers
  • Blu-ray Players and Home Theaters
  • DVD Recorders and Players
  • Desktop or Notebook PCs
  • Digital Radio or Internet Radio Players
  • Digital Video Cameras (DVC)
  • Embedded PC
  • GPS: Personal Navigation Devices
  • Mobile Internet Devices
  • Network Projector Front-End
  • Portable Media Players
  • Pro Audio Mixers
  • Smoke Detectors
  • Solid-State Drive (SSD): Enterprise
  • High-Definition (HDTV)

3 Description

This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Device Information(1)

ORDER NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC2G06DBV SOT-23 (6) 2.90 mm × 1.60 mm
SN74LVC2G06DCK SC70 (6) 2.00 mm × 1.25 mm
SN74LVC2G06DRY SON (6) 1.45 mm × 1.00 mm
SN74LVC2G06DSF SON (6) 1.00 mm × 1.00 mm
SN74LVC2G06YZP DSBGA (6) 1.41 mm × 0.91 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Logic Diagram

SN74LVC2G06 lo_ces307.gif

4 Revision History

Changes from I Revision (December 2013) to J Revision

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from H Revision (August 2012) to I Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Added ESD warning Go
  • Updated operating temperature range.Go

Changes from G Revision (January 2007) to H Revision

  • Updated package views and ordering information. Added DRY & DSF packagesGo