SCES204Q April   1999  – March 2017 SN74LVC2G125

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: TA = -40°C to +85°C
    7. 6.7 Switching Characteristics: TA = -40°C to +125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from P Revision (January 2016) to Q Revision

  • Removed '200-V Machine Model' from Features for consistency with ESD ratings table. Go
  • Added orderable part numbers associated with each package. Changed US8 to VSSOP.Go
  • Updated YZP package drawing to match mechanical drawing pinout. Go
  • Added YZP pin identifiers to Pin Function table. Added 'buffer #' to Description for pins 2, 3, 5, and 6. Changed 'Power pin' to 'Positive supply'Go
  • Added updated package thermal values based on new models. Changes: RθJA DCT 220 -> 199.0, DCU 227 -> 217.8, YZP 102 -> 99.8. Added: RθJCtop, RθJB, ψJT, ψJB.Go
  • Added 'Balanced Push-Pull Outputs,' 'CMOS Inputs,' 'Clamp Diodes,' 'Partial Power Down, 'Over-voltage Tolerant Inputs.' Removed bullet list.Go
  • Added improved layout guidelines and trace example image. Go
  • Added Documentation Support section, Receiving Notification of Documentation Updates section, and Community Resources sectionGo

Changes from O Revision (January 2015) to P Revision

Changes from N Revision (November 2013) to O Revision

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from M Revision (January 2007) to N Revision

  • Updated Features.Go
  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. Go