SCES381N January   2002  – January 2015 SN74LVC2G17 , SN74LVC2G17

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Switching Characteristics, -40°C to 125°C
    5. 6.5 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Power Button Circuit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Electrostatic Discharge Caution
    2. 12.2 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SN74LVC2G17 device contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

9.2 Typical Power Button Circuit

lvc2g17_schem.gifFigure 4. Device Power Button Circuit

9.2.1 Design Requirements

This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. Outputs can be combined to produce higher drive but the high drive will also create faster edges into light loads so routing and load conditions should be considered to prevent ringing.

9.2.2 Detailed Design Procedure

  1. Recommended Input Conditions:
  2. Recommend Output Conditions:
    • Load currents should not exceed 50 mA per output and 100 mA total for the part.
    • Series resistors on the output may be used if the user desires to slow the output edge signal or limit the output current.

9.2.3 Application Curves

graph_15_voh_v_ces794.gifFigure 5. Output Current Drive
vs HIGH-level Output Voltage
graph_15_vol_v_ces794.gifFigure 6. Output Current Drive
vs LOW-level Output Voltage