SCES381N January 2002 – January 2015 SN74LVC2G17 , SN74LVC2G17
PRODUCTION DATA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
INPUT A |
OUTPUT Y |
---|---|
H | H |
L | L |