SCES818C September 2010 – July 2024 SN74LVC2T45-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN74LVC2T45-Q1 | UNIT | |
---|---|---|---|
DCU | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 246.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 95.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 157.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 37 | °C/W |
ψJB | Junction-to-board characterization parameter | 156.9 | °C/W |