SCAS706D September   2003  – May 2024 SN74LVC32A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

SN74LVC32A-Q1 SN74LVC32A-Q1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)Figure 3-1
D or PW Package, 14-Pin SOIC or TSSOP (Top View)
SN74LVC32A-Q1 SN74LVC32A-Q1 BQA Package, 14-PIN WQFN (Top View)Figure 3-2 SN74LVC32A-Q1 BQA Package, 14-PIN WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1, Input A
1B 2 I Channel 1, Input B
1Y 3 O Channel 1, Output Y
2A 4 I Channel 2, Input A
2B 5 I Channel 2, Input B
2Y 6 O Channel 2, Output Y
GND 7 — Ground
3Y 8 O Channel 3, Output Y
3A 9 I Channel 3, Input A
3B 10 I Channel 3, Input B
4Y 11 O Channel 4, Output Y
4A 12 I Channel 4, Input A
4B 13 I Channel 4, Input B
VCC 14 — Positive Supply
Thermal Information(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power Supply, G = Ground.
(2) For BQA package only.