SCES470F August   2003  – August 2015 SN74LVC3G17

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 6.5 V
VI Input voltage(2) –0.5 6.5 V
VO Voltage applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Output voltage(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 ESD Ratings

VALUE UNIT
VESD Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) +2000 V
Charged-Device Model (CDM), per JEDEC specification JESD22-C101, all pins(2) +1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See (1).
MIN MAX UNIT
VCC Supply voltage Operating 1.65 5.5 V
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 3 V –16
–24
VCC = 4.5 V –32
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 3 V 16
24
VCC = 4.5 V 32
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SNLVC3G17 UNIT
DCT (SSOP) DCU (VSSOP) YZP (DSBGA)
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance(2) 220 227 102 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC –40°C to 85°C –40°C to 125°C UNIT
MIN TYP(1) MAX MIN TYP(1) MAX
VT+
Positive-going
input threshold
voltage		 1.65 V 0.79 1.16 0.79 1.16 V
2.3 V 1.11 1.56 1.11 1.56
3 V 1.5 1.87 1.5 1.87
4.5 V 2.16 2.74 2.16 2.74
5.5 V 2.61 3.33 2.61 3.33
VT–
Negative-going
input threshold
voltage		 1.65 V 0.39 0.62 0.39 0.62 V
2.3 V 0.58 0.87 0.58 0.87
3 V 0.84 1.14 0.84 1.14
4.5 V 1.41 1.79 1.41 1.79
5.5 V 1.87 2.29 1.87 2.29
ΔVT
Hysteresis
VT+ – VT–		 1.65 V 0.37 0.62 0.37 0.62 V
2.3 V 0.48 0.77 0.48 0.77
3 V 0.56 0.87 0.56 0.87
4.5 V 0.71 1.04 0.71 1.04
5.5 V 0.71 1.11 0.71 1.11
VOH IOH = –100 μA 1.65 V to 5.5 V VCC – 0.1 VCC – 0.1 V
IOH = –4 mA 1.65 V 1.2 1.2
IOH = –8 mA 2.3 V 1.9 1.9
IOH = –16 mA 3 V 2.4 2.4
IOH = –24 mA 2.3 2.3
IOH = –32 mA 4.5 V 3.8 3.8
VOL IOL = 100 μA 1.65 V to 5.5 V 0.1 0.1 V
IOL = 4 mA 1.65 V 0.45 0.45
IOL = 8 mA 2.3 V 0.3 0.3
IOL = 16 mA 3 V 0.4 0.4
IOL = 24 mA 0.55 0.75
IOL = 32 mA 4.5 V 0.55 0.75
II VI = 5.5 V or GND 0 to 5.5 V ±1 ±5 μA
Ioff VI or VO = 5.5 V 0 ±5 ±10 μA
ICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10 10 μA
ΔICC One input at VCC – 0.6 V,
Other inputs at VCC or GND		 3 V to 5.5 V 500 500 μA
CI VI = VCC or GND 3.3 V 4 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.

6.6 Switching Characteristics

over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS –40°C to 85°C UNIT
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 3.3 V
± 0.3 V		 VCC = 5 V
± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y See Figure 3 4.3 9.2 2 6.2 1.2 5.4 1 4.1 ns
See Figure 3 4.3 10.2 2 7.2 1.2 6.4 1 5.1

6.7 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz 18 19 19 22 pF

6.8 Typical Characteristics

SN74LVC3G17 sces470_appcurve1.pngFigure 1. Maximum Propagation vs Delay VCC Voltage