SCES481E August   2003  – August 2024 SN74LVC74A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Switching Characteristics
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74LVC74A-Q1 UNIT
BQA (WQFN) D
(SOIC)		 PW
(TSSOP)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 102.3 127.8 150.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 96.8 81.9 78.3 °C/W
RθJB Junction-to-board thermal resistance 70.9 84.4 93.8 °C/W
ψJT Junction-to-top characterization parameter 16.6 39.6 24.7 °C/W
ψJB Junction-to-board characterization parameter 70.9 83.9 93.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 50.1 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.