SCAS585Q November   1996  – December 2022 SN74LVCC3245A

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 A Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    2. 7.2 B Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    3. 7.3 B Port (VCCA = 3.6 V and VCCB = 5.5 V)
    4. 7.4 A and B Port (VCCA and VCCB = 3.6 V)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1.      Application and Implementation
        1. 9.1 Application Information
        2. 9.2 Typical Application
          1. 9.2.1 Design Requirements
          2. 9.2.2 Detailed Design Procedure
          3. 9.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power-Up Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(4)SN74LVCC3245AUNIT
DB (SSOP)DBQ (SSOP)PW (TSSOP)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance

90.7

61

100.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.9

44.8

44.7

°C/W

RθJB

Junction-to-board thermal resistance

49.7

34.5

55.8

°C/W

ψJT

Junction-to-top characterization parameter

18.8

9.5

6.8

°C/W

ψJB

Junction-to-board characterization parameter

49.3

37.2

55.4

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.