SCES008Q July   1995  – September 2018 SN54LVCH245A , SN74LVCH245A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Assignments: ZQN Package
    3.     Pin Assignments: ZXY Package
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: SN74LVCH245A
    4. 6.4  Recommended Operating Conditions: SN54LVCH245A
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics: SN74LVCH245A
    7. 6.7  Electrical Characteristics: SN54LVCH245A
    8. 6.8  Switching Characteristics: SN74LVCH245A, –40°C TO 85°C
    9. 6.9  Switching Characteristics: SN74LVCH245A, –40°C TO 125°C
    10. 6.10 Switching Characteristics: SN54LVCH245A
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Negative Clamping Diodes
      4. 8.3.4 Bus-Hold Data Inputs
      5. 8.3.5 Partial Power Down (Ioff)
      6. 8.3.6 Over-voltage Tolerant Inputs
      7. 8.3.7 Output Enable
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • DW|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

When using multiple-bit logic devices, inputs should never float.

In many cases, functions or parts of functions of digital logic devices are unused. For example, when two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Figure 14 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally, they will be tied to GND or VCC, the deciding factor is based on whichever makes more sense or is more convenient at the time. It is generally acceptable to float outputs, unless the part is a transceiver. If the transceiver has an output enable pin, then asserting the output enable pin will disable the output section of the part. This will not disable the input section of the I/Os, so they cannot float when disabled.