SCES008Q July   1995  – September 2018 SN54LVCH245A , SN74LVCH245A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Assignments: ZQN Package
    3.     Pin Assignments: ZXY Package
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: SN74LVCH245A
    4. 6.4  Recommended Operating Conditions: SN54LVCH245A
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics: SN74LVCH245A
    7. 6.7  Electrical Characteristics: SN54LVCH245A
    8. 6.8  Switching Characteristics: SN74LVCH245A, –40°C TO 85°C
    9. 6.9  Switching Characteristics: SN74LVCH245A, –40°C TO 125°C
    10. 6.10 Switching Characteristics: SN54LVCH245A
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Negative Clamping Diodes
      4. 8.3.4 Bus-Hold Data Inputs
      5. 8.3.5 Partial Power Down (Ioff)
      6. 8.3.6 Over-voltage Tolerant Inputs
      7. 8.3.7 Output Enable
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DB|20
  • NS|20
  • DW|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from P Revision (July 2014) to Q Revision

  • Changed part number column to include specific orderable parts. Go
  • Removed package name GQN. Go
  • Added ZXY package pinout section. Go
  • Changed Handling Ratings to ESD ratings. Go
  • Deleted storage temperature from ESD Ratings table.Go
  • Changed only include commercial device specifications in this table.Go
  • Added new table for military device specifications. Go
  • Deleted bulleted list of features. Go
  • Added Output Types, Input Types, Clamp Diode Structure, and Special Features sections. Go

Changes from O Revision (December 2005) to P Revision

  • Updated document to new TI data sheet standards.Go
  • Deleted Ordering Information table.Go
  • Updated Ioff Feature bullet.Go
  • Added Military Disclaimer to Features list.Go
  • Added Applications.Go
  • Added Device Information table.Go
  • Added Handling Ratings table.Go
  • Changed MAX operating temperature to 125°C. Go
  • Added Thermal Information table.Go
  • Added –40°C TO 125°C to Electrical Characteristics table.Go
  • Added data to –40°C TO 85°C Switching Characteristics table.Go
  • Added Switching Characteristics table for –40°C to 125°C for SN74LVCH245A.Go
  • Added data to Operating Characteristics table. Go
  • Added Typical Characteristics.Go
  • Added Detailed Description section.Go
  • Added Application and Implementation section.Go