SCES274I May   1999  – October 2014 SN74LVCZ244A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics, -40°C to 85°C
    7. 7.7 Switching Characteristics, -40°C to 125°C
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 VCC = 2.7 V and 3.3 V ± 0.3 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range(2) –0.5 6.5 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VO Voltage range applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 4000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 2.7 3.6 V
VIH High-level input voltage VCC = 2.7 V to 3.6 V 2 V
VIL Low-level input voltage VCC = 2.7 V to 3.6 V 0.8 V
VI Input voltage 0 5.5 V
VO Output voltage High or low state 0 VCC V
3-state 0 5.5
IOH High-level output current VCC = 2.7 V –12 mA
VCC = 3 V –24
IOL Low-level output current VCC = 2.7 V 12 mA
VCC = 3 V 24
Δt/Δv Input transition rise or fall rate 6 ns/V
Δt/ΔVCC Power-up ramp rate 150 µs/V
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74LVCZ244A UNIT
DB DW NS PW
20 PINS
RθJA Junction-to-ambient thermal resistance 97.7 78.7 77.9 103.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.4 45.0 44.5 37.9
RθJB Junction-to-board thermal resistance 52.9 46.2 45.5 54.5
ψJT Junction-to-top characterization parameter 21.4 18.3 18.3 3.3
ψJB Junction-to-board characterization parameter 52.5 45.8 45.1 53.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC –40°C TO 85°C –40°C TO 125°C UNIT
MIN TYP(1) MAX MIN TYP MAX
VOH IOH = –100 μA 2.7 V to 3.6 V VCC – 0.2 VCC – 0.2 V
IOH = –12 mA 2.7 V 2.2 2.2
3 V 2.4 2.4
IOH = –24 mA 3 V 2.2 2.2
VOL IOL = 100 μA 2.7 V to 3.6 V 0.2 0.2 V
IOL = 12 mA 2.7 V 0.4 0.4
IOL = 24 mA 3 V 0.55 0.55
II VI = 0 to 5.5 V 3.6 V ±5 ±5 μA
Ioff VI or VO = 5.5 V 0 ±5 ±5 μA
IOZ VO = 0 to 5.5 V 3.6 V ±5 ±5 μA
IOZPU VO = 0.5 to 2.5 V, OE = don't care 0 to 1.5 V ±5 ±5 μA
IOZPD VO = 0.5 to 2.5 V, OE = don't care 1.5 V to 0 ±5 ±5 μA
ICC VI = VCC or GND IO = 0 3.6 V 100 100 μA
3.6 V ≤ VI  ≤ 5.5 V(2) 100 100
ΔICC One input at VCC  –  0.6 V,  Other inputs at VCC or GND 2.7 V to 3.6 V 100 100 μA
Ci VI = VCC or GND 3.3 V 3.5 — pF
Co VO = VCC or GND 3.3 V 5.5 — pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This applies in the disabled state only.

7.6 Switching Characteristics, –40°C to 85°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT
MIN MAX MIN MAX
tpd A or B B or A 6.9 1.5 5.9 ns
ten OE A or B 8.6 1.5 7.6 ns
tdis OE A or B 6.8 1.5 6.5 ns

7.7 Switching Characteristics, –40°C to 125°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT
MIN MAX MIN MAX
tpd A or B B or A 7.4 1.5 6.4 ns
ten OE A or B 9.1 1.5 8.1 ns
tdis OE A or B 7.3 1.5 7.1 ns

7.8 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 3.3 V UNIT
TYP
Cpd Power dissipation capacitance per buffer/driver Outputs enabled f = 10 MHz 40 pF
Outputs disabled 3

7.9 Typical Characteristics

D001_SCES274.gifFigure 1. TPD Across Temperature at 3.3 V
D002_SCES274.gifFigure 2. TPD Across VCC at 25°C