SCES950
August 2022
SN74LXC1T14-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics: Tpd
6.7
Switching Characteristics: TMAX
6.8
Typical Characteristics
7
Parameter Measurement Information
7.1
Load Circuit and Voltage Waveforms
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
8.3.1.1
Input with Integrated Dynamic Pull-Down Resistors
8.3.2
Balanced High-Drive CMOS Push-Pull Outputs
8.3.3
Partial Power Down (Ioff)
8.3.4
VCC Isolation and VCC Disconnect (Ioff-float)
8.3.5
Over-Voltage Tolerant Inputs
8.3.6
Glitch-Free Power Supply Sequencing
8.3.7
Negative Clamping Diodes
8.3.8
Fully Configurable Dual-Rail Design
8.3.9
Supports High-Speed Translation
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Regulatory Requirements
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Receiving Notification of Documentation Updates
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|5
MPDS025J
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sces950_oa
sces950_pm
8.2
Functional Block Diagram