SCES938B October   2021  – May 2022 SN74LXC2T45

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: Tsk, TMAX
    7. 6.7  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    9. 6.9  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    10. 6.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    11. 6.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    12. 6.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 I/O's with Integrated Dynamic Pull-Down Resistors
        2. 8.3.1.2 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
  9. 9 Partial Power Down (Ioff)
  10. 10VCC Isolation and VCC Disconnect (Ioff-float)
  11. 11Over-Voltage Tolerant Inputs
  12. 12Glitch-Free Power Supply Sequencing
  13. 13Negative Clamping Diodes
  14. 14Fully Configurable Dual-Rail Design
  15. 15Supports High-Speed Translation
  16. 16Device Functional Modes
  17. 17Application and Implementation
    1. 17.1 Application Information
    2. 17.2 Enable Times
    3. 17.3 Typical Application
      1. 17.3.1 Design Requirements
      2. 17.3.2 Detailed Design Procedure
  18. 18Power Supply Recommendations
  19. 19Layout
    1. 19.1 Layout Guidelines
    2. 19.2 Layout Example
  20. 20Device and Documentation Support
    1. 20.1 Documentation Support
      1. 20.1.1 Related Documentation
    2. 20.2 Receiving Notification of Documentation Updates
    3. 20.3 Support Resources
    4. 20.4 Trademarks
    5. 20.5 Electrostatic Discharge Caution
    6. 20.6 Glossary
  21. 21Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 VCC Isolation and VCC Disconnect (Ioff-float)

This device has I/O's with Integrated Pull-Down Resistors. The I/O's will get pulled down and then enter a high-impedance state when either supply is < 100 mV or left floating (disconnected), while the other supply is still connected to the device. It is recommended that the I/O's for this device are not driven and kept at a logic low state prior to floating (disconnecting) either supply.

The maximum supply current is specified by ICCx, while VCCx is floating, in the Electrical Characterstics. The maximum leakage into or out of any input or output pin on the device is specified by Ioff(float) in the Electrical Characteristics.

GUID-53FAA03D-9081-4374-A938-3B058C4E6DE8-low.gif Figure 10-1 VCC Disconnect Feature