SCES916A November   2020  – March 2023 SN74LXC8T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Switching Characteristics: Tsk, TMAX
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 I/Os with Integrated Dynamic Pull-Down Resistors
        2. 8.3.1.2 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 VCC Isolation and VCC Disconnect (Ioff-float)
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Glitch-Free Power Supply Sequencing
      7. 8.3.7 Negative Clamping Diodes
      8. 8.3.8 Fully Configurable Dual-Rail Design
      9. 8.3.9 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Regulatory Requirements
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LXC8T245 UNIT
PW (TSSOP) RHL (VQFN) DGS (VSSOP) RJW (UQFN)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 99.6 47.4 86.2 118.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.7 42.6 34.6 61.2 °C/W
RθJB Junction-to-board thermal resistance 54.7 25.1 47.2 49.9 °C/W
YJT Junction-to-top characterization parameter 6.4 2.7 1.5 3.3 °C/W
YJB Junction-to-board characterization parameter 54.3 25.1 46.9 49.7 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance n/a 14.9 n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.