SCES939 April   2022 SN74LXCH1T45

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Switching Characteristics: Tsk, TMAX
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  CMOS Schmitt-Trigger Inputs
        1. 8.3.1.1 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3  Partial Power Down (Ioff)
      4. 8.3.4  VCC Isolation and VCC Disconnect
      5. 8.3.5  Over-Voltage Tolerant Inputs
      6. 8.3.6  Glitch-Free Power Supply Sequencing
      7. 8.3.7  Negative Clamping Diodes
      8. 8.3.8  Fully Configurable Dual-Rail Design
      9. 8.3.9  Supports High-Speed Translation
      10. 8.3.10 Bus-Hold Data Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Enable Times
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LXCH1T45 UNIT
DCK (SC70) DRY (SON) DTQ (X2SON)
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 205.2 293.4 285.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.4 184.0 140.0 °C/W
RθJB Junction-to-board thermal resistance 65.1 164.9 208.5 °C/W
YJT Junction-to-top characterization parameter 48.0 28.3 6.1 °C/W
YJB Junction-to-board characterization parameter 64.9 164.0 207.8 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics app report.