SCES917B December   2019  – March 2021 SN74LXCH8T245

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Switching Characteristics: Tsk, TMAX
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2  Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3  Partial Power Down (Ioff)
      4. 8.3.4  VCC Isolation and VCC Disconnect
      5. 8.3.5  Over-Voltage Tolerant Inputs
      6. 8.3.6  Glitch-Free Power Supply Sequencing
      7. 8.3.7  Negative Clamping Diodes
      8. 8.3.8  Fully Configurable Dual-Rail Design
      9. 8.3.9  Supports High-Speed Translation
      10. 8.3.10 Bus-Hold Data Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Fully Configurable Dual-Rail Design Allows Each Port to Operate from 1.1 V to 5.5 V
  • Robust, Glitch-Free Power Supply Sequencing
  • Up to 420-Mbps Support for 3.3 V to 5.0 V
  • Bus Hold on Data Inputs Eliminates the Need for External Pull-Up and Pull-Down Resistors
  • Schmitt-Trigger Control Inputs Allow for Slow or Noisy Inputs
  • Control Inputs with Integrated Static Pull-Down Resistors Allow for Floating Control Inputs
  • High Drive Strength (up to 32 mA at 5 V)
  • Low Power Consumption
    • 4-µA Maximum (25°C)
    • 12-µA Maximum (–40°C to 125°C)
  • VCC Isolation and VCC Disconnect feature
    • If Either VCC Supply is < 100 mV All I/O's Become High-Impedance
    • Ioff-float Supports VCC Disconnect Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Compatible with LVC Family Level Shifters
  • Control Logic (DIR and OE) are Referenced to VCCA
  • Operating Temperature from –40°C to +125°C
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 4000-V Human-Body Model
    • 1000-V Charged-Device Model