SCDS112E march   2001  – september 2023 SN74TVC3306

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics (AC, VGATE = 3.3 V, Translating Down)
    7. 6.7  Switching Characteristics (AC, VGATE = 2.5 V, Translating Down)
    8. 6.8  Switching Characteristics (AC, VGATE = 3.3 V, Translating Up)
    9. 6.9  Switching Characteristics (AC, VGATE = 2.5 V, Translating Up)
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Clamping
    4. 8.4 Device Functional Modes
      1. 8.4.1 Voltage Clamping
      2. 8.4.2 Voltage Passing
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Application Operating Conditions
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74TVC3306UNIT
DCTDCU
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance254.1 275.5°C/W
RθJC(top) Junction-to-case (top) thermal resistance 148.6 127.1 1 °C/W
RθJB Junction-to-board thermal resistance 168.8 186.9 °C/W
ψJT Junction-to-top characterization parameter 70.1 65.7 °C/W
ψJB Junction-to-board characterization parameter 167.4 185.9 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.