SLLS084D September   1980  – January 2024 SN75157

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Resistance Characteristics
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Typical Application
  10. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Resistance Characteristics

THERMAL METRIC(1)D (SOIC)P (PIDP)PS (SOP)UNIT
8 Pins8 Pins8 Pins
R θJAJunction-to-ambient thermal resistance 116.784.389.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.365.446.2°C/W
R θJBJunction-to-board thermal resistance 63.462.150.7°C/W
ψ JTJunction-to-top characterization parameter 8.831.323.5°C/W
ψ JBJunction-to-board characterization parameter 62.660.460.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.