SLLS100C June   1984  – October 2022 SN75176A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Dissipation Rating Table
    5. 6.5 Electrical Characteristics – Driver
    6. 6.6 Electrical Characteristics – Receiver
    7. 6.7 Switching Characteristics – Driver
    8. 6.8 Switching Characteristics – Receiver
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Driver
      2. 8.3.2 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Powered
      2. 8.4.2 Device Unpowered
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Trademarks
    2. 10.2 Electrostatic Discharge Caution
    3. 10.3 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) D P UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 66.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.3 55.6
RθJB Junction-to-board thermal resistance 63.4 42.9
ψJT Junction-to-top characterization parameter 8.8 23.9
ψJB Junction-to-board characterization parameter 62.6 42.5
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.